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Ortronics/Legrand Introduces New Secure Keyed LC Fiber Optic Solutions Ideal for High Security Government and Military ...Friday, November 21, 2008 @ 2:04AMNEW LONDON, CT -- (Marketwire) -- 11/20/08 -- Ortronics/Legrand, a global leader in high performance copper, fiber and wireless structured cabling solutions, introduces a new line of secure keyed LC multimode fiber optic connectivity products.

Opinion: Vector -- By Sonny Coloma : Faith and community in businessThursday, November 20, 2008 @ 10:05PMAt 9:00 a.m. the staff of Ancilla gathered at their library for morning prayer. This is a daily ritual that is practiced unfailingly and with devotion by the people of Ancilla, a Makati-based consulting services firm. It begins with an opening song that is sung with guitar accompaniment, followed by a gospel reading, then by a prayer.

BSQUARE Announces Free Embedded BSP For Cortex-A8 Processor-Based OMAP35x EVM From TIThursday, November 20, 2008 @ 12:41PMHelping PC programmers and embedded developers move their embedded devices into the familiar Windows operating environment without losing critical design time or added costs, BSQUARE Corporation announced the availability of a Windows Embedded CE 6.0 board support package (BSP) for the Cortex-A8 processor-based OMAP35x evaluation module (EVM) from Texas Instruments Incorporated

Agilent offers IP for mobile devicesThursday, November 20, 2008 @ 4:02AMAgilent announced a solution to help wireless-systems designers and verification engineers speed development of evolving TDD-LTE designs.

TRADE NEWS: Agilent Technologies Announces Industrys First Licensing Model Dedicated to Advanced Verification for RFICsWednesday, November 19, 2008 @ 10:59PM SANTA CLARA, Calif.----Agilent Technologies Inc. today announced the industry’s first simulation licensing model dedicated to reducing the cost of advanced verification. Used with Agilent’s GoldenGate RFIC simulation, analysis and verification software suite, the new license helps manage costs and improves large-scale RFIC yield and manufacturability.